Patrick L. McCluskey: search on Z-Library

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1

Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module

Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 2.91 MB

english, 2013

2

Effective decapsulation of copper wire-bonded microelectronic devices for reliability assessment

Manoharan, Subramani, Patel, Chandradip, McCluskey, Patrick, Pecht, Michael

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 3.34 MB

english, 2018

3

Analysis of indentation measured mechanical properties on Multilayer Ceramic Capacitors (MLCCs)

Li, Nga Man, Manoharan, Subramani, Das, Diganta, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 1.42 MB

english, 2018

4

Mechanism of wire bond shear testing

Manoharan, Subramani, Patel, Chandradip, Hunter, Stevan, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.60 MB

english, 2018

5

Review of shelf life evaluation methods and a physics of failure approach for shelf life estimation for electronic components

Li, Nga Man Jennifa, Das, Diganta, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 612 KB

english, 2019

6

Reliable use of commercial technology in high temperature environments

Patrick McCluskey, Kofi Mensah, Casey O'Connor, Anthony Gallo

Journal:

Microelectronics Reliability

Year:

2000

Language:

english

File:

PDF, 593 KB

english, 2000

7

[IEEE 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2016.7.18-2016.7.21)] 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Failure mechanisms in encapsulated copper wire-bonded devices

Manoharan, Subramani, KrishnanRamaswami, Gopal, McCluskey, F. Patrick, Pecht, Michael G.

Year:

2016

Language:

english

File:

PDF, 875 KB

english, 2016

8

[ASME ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2017 Conference on Information Storage and Processing Systems - San Francisco, California, USA (Tuesday 29 August 2017)] ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Advancements in Silver Wire Bonding

Manoharan, Subramani, Patel, Chandradip, McCluskey, Patrick

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

9

[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse, France (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Modeling the influence of mold compound and temperature profile on board level reliability of single die QFN packages

Serebreni, Maxim, McCluskey, Patrick, Ferris, Tyler, Sharon, Gil, Blattau, Nathan, Hillman, Craig

Year:

2018

Language:

english

File:

PDF, 579 KB

english, 2018

10

Predictors of morbidity following free flap reconstruction for cancer of the head and neck

Jonathan R. Clark, Stuart A. McCluskey, Francis Hall, Joan Lipa, Peter Neligan, Dale Brown, Jonathan Irish, Patrick Gullane, Ralph Gilbert

Journal:

Year:

2007

Language:

english

File:

PDF, 186 KB

english, 2007

11

Nano-thermal transport array: An instrument for combinatorial measurements of heat transfer in nanoscale films

Patrick J. McCluskey, Joost J. Vlassak

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 1.74 MB

english, 2010

12

Numerical investigation and sensitivity analysis of manifold microchannel coolers

Boteler, Lauren, Jankowski, Nicholas, McCluskey, Patrick, Morgan, Brian

Journal:

International Journal of Heat and Mass Transfer

Year:

2012

Language:

english

File:

PDF, 2.11 MB

english, 2012

13

Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices

Wang, Peng, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 1018 KB

english, 2013

14

Temperature Cycling Reliability of High-Temperature Lead-Free Die-Attach Technologies

Quintero, Pedro O., McCluskey, F. Patrick

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 981 KB

english, 2011

15

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Reliability modeling of a single phase liquid cooling system for power electronics applications

DeVoto, Douglas, McCluskey, Patrick

Year:

2010

Language:

english

File:

PDF, 549 KB

english, 2010

16

Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review

Oh, Hyunseok, Han, Bongtae, McCluskey, Patrick, Han, Changwoon, Youn, Byeng D.

Journal:

IEEE Transactions on Power Electronics

Year:

2015

Language:

english

File:

PDF, 676 KB

english, 2015

17

Combinatorial nanocalorimetry

McCluskey, Patrick J., Vlassak, Joost J.

Journal:

Journal of Materials Research

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

18

Microcontact-Enhanced Thermoelectric Cooling of Ultrahigh Heat Flux Hotspots

Manno, Michael, Yang, Bao, Khanna, Sumeer, McCluskey, Patrick, Bar-Cohen, Avram

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2015

Language:

english

File:

PDF, 1.03 MB

english, 2015

19

SPIE Proceedings [SPIE Smart Structures and Materials - San Diego, CA (Sunday 26 February 2006)] Smart Structures and Materials 2006: Smart Electronics, MEMS, BioMEMS, and Nanotechnology - Packaging of an iron-gallium nanowire acoustic sensor

DiSabatino, Jr., Ronald J., Varadan, Vijay K., McCluskey, F. Patrick, Flatau, Alison B., Stadler, Bethanie J. H.

Year:

2006

Language:

english

File:

PDF, 628 KB

english, 2006

20

[ASME ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference - Vancouver, British Columbia, Canada (July 8–12, 2007)] ASME 2007 InterPACK Conference, Volume 1 - Reliability of Indium Solder for Cold Temperature Packaging

Wu, Rui, McCluskey, F. Patrick

Year:

2007

Language:

english

File:

PDF, 123 KB

english, 2007

21

Cardiac output-based fluid optimization for kidney transplant recipients: a proof-of-concept trial; Gestion optimisée des liquides basée sur le débit cardiaque chez les transplantés rénaux : un essai de preuve de concept;

Corbella, Davide, Toppin, Patrick Jason, Ghanekar, Anand, Ayach, Nour, Schiff, Jeffery, Van Rensburg, Adrian, McCluskey, Stuart A.

Journal:

Canadian Journal of Anesthesia/Journal canadien d'anesthésie

Year:

2018

File:

PDF, 734 KB

2018

22

Novel silver die-attach technology on silver pre-sintered DBA substrates for high temperature applications

Nishimoto, Shuji, Moeini, Seyed Ali, Ohashi, Toyo, Nagatomo, Yoshiyuki, McCluskey, Patrick

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 2.49 MB

english, 2018

23

[ASME ASME 2011 International Mechanical Engineering Congress and Exposition - Denver, Colorado, USA (November 11–17, 2011)] Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration - Performance Degradation of the MEMS Vibratory Gyroscope in Harsh Environments

Patel, Chandradip, McCluskey, Patrick

Year:

2011

Language:

english

File:

PDF, 998 KB

english, 2011

24

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Mechanics of Copper Wire Bond Failure due to Thermal Fatigue

Manoharan, Subramani, Li, Nga Man Jennifa, Patel, Chandradip, Hunter, Stevan, McCluskey, Patrick

Year:

2018

Language:

english

File:

PDF, 33 KB

english, 2018

25

Unprecedented tunability of riboswitch structure and regulatory function by sub-millimolar variations in physiological Mg2+

McCluskey, Kaley, Boudreault, Julien, St-Pierre, Patrick, Perez-Gonzalez, Cibran, Chauvier, Adrien, Rizzi, Adrien, Beauregard, Pascale B, Lafontaine, Daniel A, Penedo, J Carlos

Journal:

Nucleic Acids Research

Year:

2019

Language:

english

File:

PDF, 2.50 MB

english, 2019

26

Unprecedented tunability of riboswitch structure and regulatory function by sub-millimolar variations in physiological Mg2+

McCluskey, Kaley, Boudreault, Julien, St-Pierre, Patrick, Perez-Gonzalez, Cibran, Chauvier, Adrien, Rizzi, Adrien, Beauregard, Pascale B, Lafontaine, Daniel A, Penedo, J Carlos

Journal:

Nucleic Acids Research

Year:

2019

File:

PDF, 2.50 MB

2019

27

[IEEE 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2020.7.21-2020.7.23)] 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Cooling of Integrated Electric Motors

Yao, Zhaoxi, Saadon, Yonatan, Mandel, Raphael, Patrick McCluskey, F.

Year:

2020

File:

PDF, 1.06 MB

2020

28

Clinicopathologic and therapeutic risk factors for perioperative complications and prolonged hospital stay in free flap reconstruction of the head and neck

Rajan S. Patel, Stuart A. McCluskey, David P. Goldstein, Leonid Minkovich, Jonathan C. Irish, Dale H. Brown, Patrick J. Gullane, Joan E. Lipa, Ralph W. Gilbert

Journal:

Year:

2010

Language:

english

File:

PDF, 106 KB

english, 2010

29

Reliability assessment of indium solder for low temperature electronic packaging

Rui W. Chang, F. Patrick McCluskey

Journal:

Year:

2009

Language:

english

File:

PDF, 598 KB

english, 2009

30

Constitutive Relations of Indium in Extreme-Temperature Electronic Packaging Based on Anand Model

Rui Wu Chang, F. Patrick McCluskey

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 365 KB

english, 2009

31

Thermomechanics of shape memory polymer nanocomposites

Yiping Liu, Ken Gall, Martin L Dunn, Patrick McCluskey

Journal:

Mechanics of Materials

Year:

2004

Language:

english

File:

PDF, 374 KB

english, 2004

32

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems -

Patel, Chandradip, McCluskey, Patrick, Lemus, David

Year:

2010

Language:

english

File:

PDF, 605 KB

english, 2010

33

Multicenter clinical experience with rescue atherectomy for failed angioplasty

Edward R. McCluskey, Michael Cowley, Patrick L. Whitlow

Journal:

The American Journal of Cardiology

Year:

1993

Language:

english

File:

PDF, 4.46 MB

english, 1993

34

Precipitation and thermal fatigue in Ni–Ti–Zr shape memory alloy thin films by combinatorial nanocalorimetry

Patrick J. McCluskey, Chunwang Zhao, Ofer Kfir, Joost J. Vlassak

Journal:

Acta Materialia

Year:

2011

Language:

english

File:

PDF, 1.20 MB

english, 2011

35

Analysis of Ti–Ni–Hf shape memory alloys by combinatorial nanocalorimetry

Yahya Motemani, Patrick J. McCluskey, Chunwang Zhao, Ming J. Tan, Joost J. Vlassak

Journal:

Acta Materialia

Year:

2011

Language:

english

File:

PDF, 2.18 MB

english, 2011

36

Glass transition and crystallization of amorphous Ni–Ti–Zr thin films by combinatorial nano-calorimetry

Patrick J. McCluskey, Joost J. Vlassak

Journal:

Scripta Materialia

Year:

2011

Language:

english

File:

PDF, 253 KB

english, 2011

37

Combining combinatorial nanocalorimetry and X-ray diffraction techniques to study the effects of composition and quench rate on Au–Cu–Si metallic glasses

John M. Gregoire, Patrick J. McCluskey, Darren Dale, Shiyan Ding, Jan Schroers, Joost J. Vlassak

Journal:

Scripta Materialia

Year:

2012

Language:

english

File:

PDF, 509 KB

english, 2012

38

Outcomes of cytomegalovirus retinitis following the use of ganciclovir implants

Peter J McCluskey, Rajiv Shah, Patrick Versace

Journal:

Clinical & Experimental Ophthalmology

Year:

1998

Language:

english

File:

PDF, 388 KB

english, 1998

39

Use of ultrasound to demonstrate gallstones in symptomatic patients with normal oral cholecystograms

Patrick L. McCluskey, Richard A. Prinz, Rogelio Guico, Herbert B. Greenlee

Journal:

The American Journal of Surgery

Year:

1979

Language:

english

File:

PDF, 360 KB

english, 1979

40

AS24 The relationship between healthcare staff height and the ability to perform effective chest compressions in adults

Trevor McNulty, Patrick Gallagher, B.J. Rice, David McCluskey, Chris Walsh

Journal:

Year:

2011

Language:

english

File:

PDF, 66 KB

english, 2011

41

Evaluation of baking properties and gluten protein composition of field grown transgenic wheat lines expressing high molecular weight glutenin gene 1Ax1

Indra K. Vasil, Scott Bean, Jianmin Zhao, Patrick McCluskey, George Lookhart, Hua-Ping Zhao, Fredy Altpeter, Vimla Vasil

Journal:

Journal of Plant Physiology

Year:

2001

Language:

english

File:

PDF, 102 KB

english, 2001

42

A scanning AC calorimetry technique for the analysis of nano-scale quantities of materials

Xiao, Kechao, Gregoire, John M., McCluskey, Patrick J., Vlassak, Joost J.

Journal:

Review of Scientific Instruments

Year:

2012

Language:

english

File:

PDF, 3.16 MB

english, 2012

43

Improving quality of life by increasing outings after stroke: study protocol for the Out-and-About trial

McCluskey, Annie, Ada, Louise, Middleton, Sandy, Kelly, Patrick J., Goodall, Stephen, Grimshaw, Jeremy M., Logan, Pip, Longworth, Mark, Karageorge, A.

Journal:

International Journal of Stroke

Year:

2013

Language:

english

File:

PDF, 165 KB

english, 2013

44

[IEEE 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2012.05.30-2012.06.1)] 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Modeling and simulation of the MEMS vibratory gyroscope

Patel, Chandradip, McCluskey, Patrick

Year:

2012

Language:

english

File:

PDF, 314 KB

english, 2012

45

MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor

Jain, Rupal, McCluskey, F. Patrick, Flatau, Alison B.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.64 MB

english, 2011

46

A review of phase change materials for vehicle component thermal buffering

Jankowski, Nicholas R., McCluskey, F. Patrick

Journal:

Year:

2014

Language:

english

File:

PDF, 3.12 MB

english, 2014

47

The Effect of Pilocarpine on the Visual Field in Normals

McCluskey, Druann J., Douglas, John P., O'Connor, Patrick S., Story, Kristin, Ivy, Linda M., Harvey, J. Steven

Journal:

Year:

1986

Language:

english

File:

PDF, 625 KB

english, 1986

48

[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Assessing solder interconnect reliability of control boards in power electronic systems using Physics-of-Failure models

Squiller, David, Mengotti, Elena, McCluskey, Patrick

Year:

2014

Language:

english

File:

PDF, 912 KB

english, 2014

49

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Transient liquid phase sintered attach for power electronics

Greve, Hannes, Chen, Liang-Yu, Fox, Ian, McCluskey, F. Patrick

Year:

2013

Language:

english

File:

PDF, 1.79 MB

english, 2013

50

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Reliability of paste based transient liquid phase sintered interconnects

Greve, Hannes, Moeini, S. Ali, McCluskey, F. Patrick

Year:

2014

File:

PDF, 3.88 MB

2014